Journal
IEEE PHOTONICS TECHNOLOGY LETTERS
Volume 30, Issue 2, Pages 181-184Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LPT.2017.2779798
Keywords
Gallium nitride (GaN); avalanche photodiode (APD); ultraviolet (UV); separate absorption and multiplication (SAM); metalorganic chemical vapor deposition (MOCVD)
Funding
- U.S. Army Research Office [W911NF-15-1-0489]
- Georgia Tech Institute for Electronics and Nanotechnology
- National Science Foundation through a member of the National Nanotechnology Coordinated Infrastructure [ECCS-1542174]
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Front-illuminated GaN-based separate absorption and multiplication (SAM) ultraviolet (UV) avalanche photodiodes (APDs) with various photon detection areas are demonstrated grown by metalorganic chemical vapor deposition on bulk GaN native substrates with low dislocation density. By adopting a front-illuminated UV-APD structure with a thin AlGaN window layer, no additional etching of the substrate for the reduction of strong UV absorption is required. The epitaxial layer structure of the p-i-p-i-n SAM UV-APDs consists of a Mg-doped p-Al0.05Ga0.95N window layer to minimize UV absorption at the top surface region and a Mg-graded p-GaN charge layer to serve as a field-termination layer. The onset point of the breakdown voltage (V-BR) is around 73 V for all SAM-APDs with different mesa areas ranging from 1963 to 10 000 mu m(2), which is a lower V-BR than the typical p-i-n UV-APDs with the similar thickness of undoped layer, where the photon absorption and multiplication processes take place simultaneously. Under UV-light illumination at lambda = 340 nm, the SAM-APDs exhibit high avalanche gains greater than 8.0 x 10(5) at a reverse bias of V-R > 72.5 V.
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