Journal
COMPOSITE STRUCTURES
Volume 193, Issue -, Pages 212-223Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compstruct.2018.03.030
Keywords
C/SiC composite; Plain woven; Thermal conductivity; Micromechanical model
Categories
Funding
- National Key Research and Development Program of China [2017YFB1102800]
- Key Research and Development Program of Shaanxi Province [2017KJXX-31]
- Shaanxi International Science and Technology Cooperation and Exchange Program [2016KW-057]
- National Natural Science Foundation of China [51521061]
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In this paper a micromechanical model considering PyC interphase thermal conductance and manufacture-induced voids is proposed to predict the thermal conductivities of plain woven C/SiC composite. This model is based upon the analysis of the representative volume element (RVE) models of composite. The modeling strategy starts with a geometrical description and finite element discretization on two scales consisting of the fiber yarn modeling (fiber-scale) followed by a woven fabric modeling (yarn-scale). The PyC interphase is introduced in the fiber-scale modeling while the large voids at the intersection of orthogonal yarns are included in the yarn-scale modeling. Experiments are conducted to measure the thermal conductivities of plain woven C/SiC samples from room temperature to 800 degrees C temperature. The satisfied agreement with experimental data has highlighted the predictive capability of the proposed micromechanical model. Finally, a parametric study is performed using the presented model to investigate the effects of PyC interphase thermal conductance and manufacture-induced voids on the thermal conductivities of composite.
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