Journal
2015 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS)
Volume -, Issue -, Pages -Publisher
IEEE
DOI: 10.1109/ULTSYM.2015.0471
Keywords
capacitive Micro-machined Ultrasonic Transducer; galvanic isolation; Finite Elements Method; power transmission
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This study relies on double-sided chips where capacitive Micromachined Ultrasonic Transducers (cMUT) are manufactured on both sides of a silicon substrate in order to perform galvanic isolation between two electrical circuits. The operating principle is based on the propagation of acoustic waves from one transducer to the other, providing a high level of electrical isolation. The work presented here focuses mainly on the assessment of the power efficiency, from an experimental and from a theoretical point of view. Encouraging power efficiency values were reached, showing a significant efficiency gain when taking advantage of the coupling with the substrate.
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