3.8 Proceedings Paper

Simulation of warpage induced by non-isothermal crystallization of co-Polypropylene during the SLS process

Publisher

AMER INST PHYSICS
DOI: 10.1063/1.4918509

Keywords

Additive Manufacturing; Selective Laser Sintering; 3D-Printing; Polymer Crystallization; ELM Simulation

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Polymer processing using Additive Manufacturing Technologies (AM) has experienced a remarkable growth during the last years. The application range has been expanding rapidly, particularly driven by the so-called consumer 3D printing sector. However, for applications demanding higher requirements in terms of thermo-mechanical properties and dimensional accuracy the long established AM technologies such as Selective Laser Sintering (SLS) do not depict a comparable development. The higher process complexity hinders the number of materials that can be currently processed and the interactions between the different physics involved have not been fully investigated. In case of thermoplastic materials the crystallization kinetics coupled to the shrinkage strain development strongly influences the stability of the process. Thus, the current investigation presents a transient Finite Element simulation of the warpage effect during the SLS process of a new developed polyolefin (co-polypropylene) coupling the thermal, mechanical and phase change equations that control the process. A thermal characterization of the material was performed by means of DSC, integrating the Nakamura model with the classical Hoffmaim-Lauritzen theory. The viscoelastic behavior was measured using a plate-plate rheometer at different degrees of undercooling and a phase change-temperature superposition principle was implemented. Additionally, for validation porpoises the warpage development of the first sintered layers was captured employing an optical device. The simulation results depict a good agreement with experimental measurements of deformation, describing the high sensitivity of the geometrical accuracy of the sintered parts related to the processing conditions.

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