Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 10, Issue 4, Pages 3830-3837Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsami.7b19161
Keywords
reactive silver; metal-organic decomposition; silver oxalate complex; printed electronics; photonic curing
Funding
- AMPrint Center grant - Empire State Development Corporation
- Nanoimaging Laboratory and Advanced Materials Laboratory at Rochester Institute of Technology, Rochester, NY
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A solid silver-ligand complex, mu-oxolato-bis(ethylenediaminesilver(I)), was developed for formulating particle-free conductive metal-organic decomposition (MOD) inkjet inks. The complex comprises both a high molar silver content and solubility in inkjet compatible polar solvents. An aqueous ink formulation with 29.5 wt % silver content was developed and inkjet printed onto glass, polyethylene terephthalate, and polyimide substrates. A new hybrid thermal-photonic curing approach resulting in substantially improved electrical properties and substrate adhesion is presented. Silver conductive traces were measured to have bulk resistivity of 4.26 x 10(-8) Omega m, which is 2.7 times that of bulk silver. One-pot complex synthesis yielded an easily isolated, and stable, solid product that can be formulated when needed thereby improving shelf life.
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