Journal
ADVANCED MATERIALS TECHNOLOGIES
Volume 2, Issue 4, Pages -Publisher
WILEY
DOI: 10.1002/admt.201600262
Keywords
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Categories
Funding
- NSFC [61674127, 61274123, 61474099, 61431014, 51650110494, 21325417, 51533008]
- ZJ-NSF [LZ17F040001]
- China State Key Project [2016YFA0200204]
- China Postdoctoral Science Foundation [2015M571868]
- micro-/nanofabrication platform of Zhejiang University
- Fundamental Research Funds for the Central Universities [2016XZZX001-05]
- USA National Science Foundation [DMR1508144]
- ZJU Cyber Scholarship
- Cyrus Tang Center for Sensor Materials and Applications
- Open Research Fund of State Key Laboratory of Bioelectronics
- Southeast University
- Open Research Fund of State Key Laboratory of Nanodevices and Applications at Chinese Academy of Sciences [14ZS01]
- Fellowship of Churchill College at University of Cambridge
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By exploiting the adsorbent gaseous molecules induced changes in intrinsic properties of graphene/silicon (Gr/Si) Schottky junction, the authors report a sensitive, low-power consuming, multimode environmental sensor. By combining an array of Gr/Si Schottky diodes with a differential amplifier circuit, the authors are able to not only differentiate the temperature coefficient and humidity sensing, but also monitor the sun-light exposure time. Our device is particularly sensitive toward humidity in both forward and reverse biased, and works in resistive as well as capacitive mode. Sensitivity of our devices reached to 17%, 45%, 26%, and 32% per relative humidity (%RH) for reverse biased, forward biased, resistive, and capacitive modes, respectively. In the reverse mode, the power consumption is as low as 2 nW. Moreover, our sensor response is highly selective, with sensitivity lower than 1% for other gases present in atmosphere including H-2, O-2, N-2, and CO2. High sensitivity, low-power consumption, multiple operation modes, and high selectivity promises application of our sensor for industrial and home safety, environmental monitoring such as indoor and outdoor air conditions, process monitoring, and others.
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