Journal
COMPOSITES COMMUNICATIONS
Volume 2, Issue -, Pages 19-24Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.coco.2016.10.002
Keywords
Hexagonal boron nitride; Polymeric composites; Thermal management
Categories
Funding
- NSFC
- NSFCRGC Joint Research Scheme [11272008, 11361161001, CUHK450/13]
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Thermal management is more and more crucial in advanced electronic devices with increasing power density. So, the demand for the materials with high thermal conductivity is rising. Hexagonal boron nitride (h-BN), called as white graphene, has high thermal conductivity of similar to 2000 W m(-1) K-1 (by theoretical calculation) and is an electrical insulator, so h-BN filled polymer composite becomes a good candidate for potential employment in heat management of microelectronic devices. This paper gives a brief review on the development of h-BN based polymeric composites, including thermal transfer mechanism, fundamental design principle and application, as well as perspectives.
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