Journal
ADVANCED MATERIALS INTERFACES
Volume 4, Issue 17, Pages -Publisher
WILEY
DOI: 10.1002/admi.201700446
Keywords
orientation; polymer composites; silicon carbide nanowires; thermal conductivity
Funding
- National Natural Science Foundation of China [51603226]
- Guangdong Provincial Key Laboratory [2014B030301014]
Ask authors/readers for more resources
Highly thermally conductive polymer composites have received considerable attention, along with development of electronic devices toward being more integrated, miniaturized, and functionalized. However, traditional polymer composites cannot meet the requirement of achieving higher thermal conductivity at relatively low filler loading. Herein, manipulating orientation of silicon carbide nanowire (SiCNW) in epoxy composites by coating method is reported to achieve high in-plane thermal conductivity (10.10 W m(-1) K-1) at extremely low filler loading (5 wt%), while it is only 1.78 and 0.30 W m(-1) K-1 for epoxy/random SiCNW composite and epoxy/silicon carbide nanoparticle composite. Several models are employed to demonstrate that a good orientation and high aspect ratio of SiCNWs contribute to form heat transfer networks in the composites. This provides a promising future for thermal-management materials, which are widely applied to electronic packaging, aerospace field, and medical engineering.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available