Journal
JOURNAL OF MATERIALS CHEMISTRY C
Volume 5, Issue 5, Pages 1033-1041Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c6tc04360g
Keywords
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Funding
- Canon Foundation
- Hokkaido University
- Cooperative Research Program of 'Network Joint Research Center for Materials and Devices'
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A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2- propanol (CuF-IPA) complex as an additive. The sintering temperature used in this study was as low as 100 degrees C. Following sintering at a temperature of 100 degrees C, the lowest reported resistivity (8.8 x 10(-7) Omega m) was achieved through the use of Cu-based metal-organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF-IPA complex.
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