4.4 Article

Potassium Oleate as a Dissolution and Corrosion Inhibitor during Chemical Mechanical Planarization of Chemical Vapor Deposited Co Films for Interconnect Applications

Journal

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
Volume 6, Issue 12, Pages P845-P852

Publisher

ELECTROCHEMICAL SOC INC
DOI: 10.1149/2.0251712jss

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Funding

  1. IBM

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1,2-4 Triazole (TAZ), N-lauroylsarcosine sodium salt (NLS) and potassium oleate (PO) were tested as passivating additives to previously developed H2O2 and citric acid-based silica dispersions for the polishing of chemical vapor deposited Co films for interconnect applications. In comparison to TAZ and NLS, Co corrosion currents are similar to 1 to 2 order of magnitude lower (similar to 1-3 mu A cm(-2)) at pH 7 with PO and post-polish surface quality was much better. The galvanic corrosion currents between Co-Ti and Ti-TiN couples with PO were also very low (similar to 0.1 mu A cm(-2)), making the previously developed silica and citric acid-based dispersion, now containing PO, suitable for both bulk removal of Co (step I) and for planarizing Co/Ti/TiN structures (step II) with excellent selectivity while stopping on low-k dielectric. Langmuir adsorption isotherm model analysis showed that the standard free energies of adsorption values were similar to 40 kJ/mol for PO suggesting chemisorption. Fourier transform infra-red (FTIR) and attenuated FTIR spectroscopy data show bridging coordination between the carboxylate ligand of PO and the Co surface. (c) The Author(s) 2017. Published by ECS. All rights reserved.

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