Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 9, Issue 10, Pages 8766-8773Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsami.6b14462
Keywords
printed electronics; copper ink; plasma; copper complex; low temperature; high conductivity
Funding
- Israel Ministry of Science, Technology Space
- Israel National Nanotechnology Initiative
- National Research Foundation
- Prime Minister's Office, Singapore
- Nanomaterials for Energy and Energy Water nexus
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The use of Cu-formate-2-amino-2-methyl-1propanol ink and low-pressure plasma for the formation of highly conductive patterns on heat sensitive plastic substrates was studied. It was found that plasma results in decomposition of copper complex to form metallic copper without heating at high temperatures. Ink composition and plasma parameters (predrying conditions, plasma treatment duration, gas type, and flow rate) were optimized to obtain uniform conductive metallic films. The morphology and electrical characteristics of these films were evaluated. Exposing the printed copper metallo-organic decomposition (MOD) ink to 160 W plasma for 8 min yielded resistivity as low as 7.3 +/- 0.2 mu Omega cm, which corresponds to 23% bulk copper conductivity. These results demonstrate the applicability of MOD inks and plasma treatment to obtain highly conductive printed patterns on low-cost plastic substrates and 3D printed polymers.
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