Journal
APPLIED SURFACE SCIENCE
Volume 396, Issue -, Pages 202-207Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.apsusc.2016.09.152
Keywords
Reactive inkjet printing; Conductive copper patterns; Electroless plating; Catalyst
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Funding
- National Natural Science Foundation of China [61271040, 61471106]
- Teachers' Scientific Research Foundation for UESTC [ZYGX2015KYQD059]
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A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and reducing ink, and then the conductive copper patterns were generated after a two-step electroless plating procedure. The copper layers were characterized by optical microscope, SEM, XRD and EDS. Homogeneously distributed copper nanoclusters were found in the catalyst patterns. A thin copper layer with uniform particle size was formed after first-step electroless plating, and a thick copper layer of about 14.3 mu m with closely packed structure and fine crystallinity was produced after second-step electroless plating. This resulting copper layer had good solderability, reliable adhesion strength and a low resistivity of 5.68 mu Omega cm without any sintering process. (C) 2016 Elsevier B.V. All rights reserved.
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