Journal
CERAMICS INTERNATIONAL
Volume 43, Issue 6, Pages 5302-5310Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.ceramint.2017.01.067
Keywords
Lead-free solder; Nanocomposite; Sn-Cu; SiO2; Mechanical properties; Microstructure; Wettability
Categories
Funding
- Iran National Science Foundation (INSF) [94-S-44221]
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Sn-0.7Cu is among the least expensive types of lead-free solders available. However, its poor mechanical properties have limited its application. In this study, Sn-Cu lead-free solder reinforced with amorphous silica (SiO2) nanoparticles was synthesized through powder metallurgy route. Desired mixtures of raw materials was mechanically milled, compressed, sintered and extruded to prepare bulk solder samples. The samples were characterized by optical and electron microscopy as well as mechanical tests. The results showed that mechanical properties were increased by addition of SiO2 nanoparticles to the solder matrix. Addition of 1.5 wt% ceramic reinforcement to the composite increased tensile, yield and compressive strengths up to 27%, 23% and 41%, respectively, compared to those of the monolithic sample. In addition, the ceramic nanoparticles caused an up to 50% decrease in the wetting angle between the substrate and the nanocomposite solder.
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