4.7 Article

Experimental study of thermal and airtightness performance of structural insulated panel joints in cold climates

Journal

BUILDING AND ENVIRONMENT
Volume 115, Issue -, Pages 345-357

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.buildenv.2017.01.031

Keywords

Arctic conditions; Structural insulated panel; Joints; Air leakage; Heat,air, and moisture transfer; Full-scale laboratory testing

Funding

  1. NSERC Scholarship
  2. Concordia University Graduate Doctoral Fellowship
  3. ecoENERGY Innovation Initiative
  4. NSERC Smart Net-zero Energy Buildings Strategic Research Network

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The extreme climate and limited nature of local resources in the arctic create serious challenges for the many Inuit communities. Homelessness and housing shortages are still common, underlining the need for the construction of durable, sustainable, and affordable housing. The building envelope is highly susceptible to moisture damage and deterioration if not well designed and constructed, especially in the arctic. For this project, the thermal and airtightness performance of structural insulated panel (SIP) joints are studied. A full-scale test hut built with SIPs was constructed and tested in an environmental chamber at 20 degrees C and 40 degrees C, simulating arctic conditions. Eight types of SIP joints were monitored with thermocouples, with at least 6 thermocouples per joint. The SIPs were subjected to temperature differences of up to 62 degrees C and pressure differences up to 15 Pa. It is found that joints connecting three envelope elements are leakier and more susceptible to moisture damage than those connecting two. Though all joints are dependent on the tape seal to maintain airtightness, it is more difficult to ensure good air seal for the more complex joints. All the joints can be improved to be less dependent on the tape, though the joints most susceptible to moisture damage and mold grdwth are the top joints since moist indoor air tends to exfiltrate at those locations due to stack effect. (C) 2017 Elsevier Ltd. All rights reserved.

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