Journal
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 123, Issue 5, Pages -Publisher
SPRINGER
DOI: 10.1007/s00339-017-0927-0
Keywords
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Funding
- West Midlands European Regional Development Fund (ERDF) project, Leverhulme Trust
- Leverhulme Trust [2014-304]
- FP7-PEOPLE-IAPP [324391]
- FP7-NEWLED [318388]
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The quality of the reflecting faces after dicing is critical for the fabrication of efficient and stable laser diodes emitting in the green-violet region. However, highquality faces can be difficult to achieve for devices grown on a sapphire substrate as this material is difficult to cleave cleanly. We have therefore investigated a technology known as stealth dicing. The technology uses a pulsed laser to damage a plane of material inside of the wafer due to multiphoton absorption instead of cutting through the wafer surface. If the damage is induced in a line of stress points, the sample can then be cleaved easily along the damaged plane to leave a high-quality surface. The use of this technique also reduces thermal damage and debris.
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