Journal
MATERIALS
Volume 10, Issue 4, Pages -Publisher
MDPI
DOI: 10.3390/ma10040327
Keywords
Cu6Sn5 whiskers; Ag3Sn fibers; mechanical property; screw dislocation
Categories
Funding
- Natural Science Foundation of China [51475220]
- Qing Lan Project
- China Postdoctoral Science Foundation [2016M591464]
- Six talent peaks project in Jiangsu Province [XCL-022]
- State Foundation of Laboratory of Advanced Brazing Filler Metals Technology [SKLABFMT-2015-03]
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Cu6Sn5 whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag3Sn fibers can be observed around Cu6Sn5 whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu6Sn5 whiskers can be observed, and hexagonal rod structure is the main morphology of Cu6Sn5 whiskers. A hollow structure can be observed in hexagonal Cu6Sn5 whiskers, and a screw dislocation mechanism was used to represent the Cu6Sn5 growth. Based on mechanical property testing and finite element simulation, Cu6Sn5 whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer.
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