Journal
OPTICAL MATERIALS EXPRESS
Volume 7, Issue 12, Pages 4408-4414Publisher
OPTICAL SOC AMER
DOI: 10.1364/OME.7.004408
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Funding
- Science Foundation Ireland [12/RC/2276 (IPIC), 15/IA/2864]
- European Union's Horizon Research and Innovation Programme [45314 (TOP-HIT)]
- Science Foundation Ireland (SFI) [15/IA/2864] Funding Source: Science Foundation Ireland (SFI)
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Heterogeneous integration of InP devices to Si substrates by adhesive- less micro transfer printing requires flat surfaces for optimum attachment and thermal sinking. InGaAs and InAlAs sacrificial layers are compared for the selective undercut of InP coupons by FeCl3:H2O (1: 2). InAlAs offers isotropic etches and superior selectivity (> 4,000) to InP when compared with InGaAs. A 500 nm thick InAlAs sacrificial layer allows the release of wide coupons with a surface roughness < 2 nm and a flatness < 20 nm. The InAlAs release technology is applied to the transfer printing of a pre-fabricated InP laser to a Si substrate. (C) 2017 Optical Society of America under the terms of the OSA Open Access Publishing Agreement
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