Journal
APPLIED PHYSICS LETTERS
Volume 110, Issue 23, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.4985435
Keywords
-
Categories
Funding
- NKRDP of China [2016YFA0301802]
- NSFC [11474152, 91321310, 11274156, 11504165, 61521001]
Ask authors/readers for more resources
Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging superconducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts. Since the contacts extend beyond the surface of the dielectric layer, chips can simply be flip-chip packaged with on-chip receptacles clinging to the contacts. Using this scheme, we packaged a multi-qubit chip and performed single-qubit and two-qubit quantum gate operations. The results indicate that this 3D architecture provides a promising scheme for scalable quantum computing. Published by AIP Publishing.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available