Journal
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume 7, Issue 5, Pages 653-668Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2016.2636296
Keywords
Domain decomposition (DD) method; electromagnetic interference (EMI); integrated circuit (IC); signal integrity (SI)
Categories
Funding
- AFOSR COE: Science of Electronics in Extreme Electromagnetic Environments [FA9550-15-1-0171]
- U.S. Department of Defense HPC Modernization Program [PP-CEA-KY07-001-P3]
- Division of Computing and Communication Foundations
- Direct For Computer & Info Scie & Enginr [1526605] Funding Source: National Science Foundation
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Ever-increasing complexity in high-speed electronic devices and systems presents significant computational challenges in the numerical analysis in terms of desired accuracy, efficiency, and scalable parallelism. The objective of this paper is to investigate high-resolution, high-performance full-wave field solvers for scalable electromagnetic simulations of product-level integrated circuits (ICs) and electronics. The emphasis is placed on advancing parallel algorithms that are provably scalable facilitating a design-through-analysis paradigm, and enabling concurrent multiscale modeling and computation. The capability and the benefits of the algorithms are validated and illustrated through complex 3-D IC and electronics applications.
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