Nanoporous Copper Films by Additive-Controlled Electrodeposition: CO2 Reduction Catalysis

Electrodeposition from plating baths containing 3,S-diamino-1,2,4-triazole (DAT) as an inhibitor gives Cu films exhibiting high surface area and high CO2 reduction activities. By changes in the pH and deposition current density, the morphologies of the Cu films are varied to exhibit wire, dot, and amorphous structures. Among these Cu films, the CuDAT-wire samples exhibit the best CO2 reduction activities activity with a Faradaic efficiency (FE) for C2H4 product formation reaching 40% at -0.5 V vs RHE, a FE for C2H5OH formation reaching 20% at -0.5 V vs RHE, and a mass activity for CO2 reduction at -0.7 V vs RHE of similar to 700 A/g.