4.7 Article

Application of finite element, phase-field, and CALPHAD-based methods to additive manufacturing of Ni-based superalloys

Journal

ACTA MATERIALIA
Volume 139, Issue -, Pages 244-253

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2017.05.003

Keywords

Additive manufacturing; Finite element analysis (FEA); CALPHAD; Phase-field simulations; Microsegregation

Funding

  1. U.S. DOE [DE-AC02-06CH11357]
  2. U.S. DOE [DE-AC02-06CH11357]

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Numerical simulations are used in this work to investigate aspects of microstructure and micro segregation during rapid solidification of a Ni-based superalloy in a laser powder bed fusion additive manufacturing process. Thermal modeling by finite element analysis simulates the laser melt pool, with surface temperatures in agreement with in situ thermographic measurements on Inconel 625. Geometric and thermal features of the simulated melt pools are extracted and used in subsequent mesoscale simulations. Solidification in the melt pool is simulated on two length scales. For the multicomponent alloy Inconel 625, microsegregation between dendrite arms is calculated using the Scheil-Gulliver solidification model and DICTRA software. Phase-field simulations, using Ni-Nb as a binary analogue to Inconel 625, produced microstructures with primary cellular/dendritic arm spacings in agreement with measured spacings in experimentally observed microstructures and a lesser extent of microsegregation than predicted by DICTRA simulations. The composition profiles are used to compare thermodynamic driving forces for nucleation against experimentally observed precipitates identified by electron and Xray diffraction analyses. Our analysis lists the precipitates that may form from FCC phase of enriched interdendritic compositions and compares these against experimentally observed phases from 1 h heat treatments at two temperatures: stress relief at 1143 K (870 degrees C) or homogenization at 1423 K (1150 degrees C). Published by Elsevier Ltd on behalf of Acta Materialia Inc.

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