Journal
IEEE TRANSACTIONS ON RADIATION AND PLASMA MEDICAL SCIENCES
Volume 1, Issue 6, Pages 486-494Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TRPMS.2017.2757444
Keywords
3-D digital SiPM (3DdSiPM); 3-D integrated detector; electronics; high energy physics (HEP); light detection and ranging (LIDAR); photodetector technology; positron emission tomography (PET); semiconductors; single photon avalanche diode (SPAD); single photon timing resolution; time correlated single photon counting (TCSPC); time-of-flight (TOF); time-to-digital converter (TDC)
Funding
- Natural Sciences and Engineering Research Council of Canada
- Fonds de recherche Nature et technologies
- Regroupement Strategique en Microsystemes du Quebec
- CMC Microsystems
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Time-of-flight measurements are becoming essential to the advancement of several fields, such as preclinical positron emission tomography and high energy physics. Recent developments in single photon avalanche diode (SPAD)-based detectors have spawned a great interest in digital silicon photomultipliers (dSiPMs). To overcome the tradeoff between the photosensitive area and the processing capabilities in current 2-D dSiPM, we propose a novel 3-D digital SiPM, where the SPAD, designed for maximal photosensitive area, will be stacked in 3-D over the electronic circuits, designed in a CMOS node technology. All readout circuits will be implemented directly under the SPAD real estate, including quenching circuit, time-to-digital converter (TDC) and digital readout electronics. This paper focusses on the TDC element of this system, designed in TSMC CMOS 65 nm. This ring oscillator-based Vernier TDC requires only 25 x 50 mu m(2) and 160 mu W, and achieves 6.9 ps rms timing accuracy.
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