Journal
ULTRAMICROSCOPY
Volume 177, Issue -, Pages 43-52Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.ultramic.2017.01.020
Keywords
t-EBSD; Spatial resolution; Depth resolution; DIC
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Funding
- Ministry of Science and Technology [MOST 103-2221-E-006-060-MY3, MOST 103-2622-E-006-037]
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A quantitative approach was proposed to determine the spatial resolution of transmission electron backscatter diffraction (t-EBSD) and to understand the limits of spatial resolution of t-EBSD. In this approach, Cu bicrystals and digital image correlation were employed. The effects of accelerating voltage and specimen thickness on the spatial resolution of t-EBSD were also investigated. t-EBSD specimens with 8 mu m x 10 mu m dimensions and different thicknesses were prepared using focused ion beam milling. The optimized quality of Kikuchi pattern was achieved at a working distance of 12 mm and a tilting angle of 20 degrees. The optimum depth resolution of 34.4nm was observed in the lower surface of a 100 nm thick sample at 25 kV. Thus, the penetration depth from the upper surface is 65.6 nm. The optimum lateral and longitudinal resolutions obtained from a 100 nm thick sample at 30 kV are 25.2 and 43.4 nm, respectively. The spatial resolution of t-EBSD can be enhanced by increasing the accelerating voltage and decreasing the sample thickness. (C) 2017 Elsevier B.V. All rights reserved.
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