Journal
THIN SOLID FILMS
Volume 642, Issue -, Pages 82-89Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2017.09.007
Keywords
Metastable phases; Nanocrystalline nanostructure; Nanoindentation; X-ray diffraction; Copper; Tungsten; Sputtering
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Funding
- STEEP, a Marie Curie Action Initial Training Network (ITN) of the European Union's Seventh Framework Program FP7 under REA [316560]
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A combinatorial science approach is utilized to study the microstructural and mechanical properties of metastable copper-tungsten solid solutions. Lateral compositional gradient (also called composition-spread) samples were deposited by simultaneously sputtering copper and tungsten targets positioned obliquely at opposite ends of a silicon substrate. The chemical composition of the film varies continuously along its length from 12 to 45 atomic % copper and has a nominal thickness of 1 mu m. Nanoindentation was performed to measure the hardness and elastic modulus of the film. Grain size and solid solution strengthening models are applied to interpret the hardness of the film, though a simple rule of mixtures is found to give a more satisfactory fit to the data. The elastic modulus of the film is consistently below that predicted by the rule of mixtures. X-ray diffraction revealed plane spacing less than that predicted by Vegard's law as well as three chemical compositions exhibiting enhanced long-range order. Transmission electron microscopy analysis confirms that the film consists of a single metastable body centred cubic solid solution where the lattice spacing and grain size depend on chemical composition.
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