3.8 Proceedings Paper

Deep Silicon Etching for X-Ray Diffraction Devices Fabrication

Publisher

IEEE

Keywords

cryogenic silicon etching; Bosch process; x-ray gratings

Ask authors/readers for more resources

We report deep reactive ion etching of silicon gratings via cryogenic and Bosch processes. An aspect ratio of > 50 is achieved for 400 nm period gratings with both processes.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

3.8
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available