Journal
SOLDERING & SURFACE MOUNT TECHNOLOGY
Volume 29, Issue 2, Pages 92-98Publisher
EMERALD GROUP PUBLISHING LTD
DOI: 10.1108/SSMT-06-2016-0013
Keywords
Intermetallic compounds; Microstructure; Copper; Solder paste; Composite materials
Categories
Funding
- National Natural Science Foundation of China [51174069]
- University Nursing Program for Young Scholars with Creative Talents in Heilongjiang Province [UNPYSCT-2015042]
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Purpose - The purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure evolution of resultant nanocomposite solder after reflow and thermal aging. Design/methodology/approach - Mechanical mixing is used in this work to incorporate nanoparticles into the solder and produce more homogeneous mixture. Standard metallographic procedures are applied for microstructural analysis of solder joints. Findings - It is found that nano-Cu doped into Sn0.7Ag0.5Cu-BiNi solder has no appreciable influence on melting temperature of the composite solder. The addition of Cu nanoparticles refines the microstructure of bulk solder and suppresses the growth of interfacial intermetallic compound (IMC) layers. However, interfacial IMC grain size increases slightly after 1.0 per cent nano-Cu added. Originality/value - The paper demonstrates a method of nano- composite solder paste preparation by means of mechanical mixing and a comparison study of the microstructure evolution of composite solder with the basic SAC solder.
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