4.8 Article

A Low-Cost NiO Hole Transfer Layer for Ohmic Back Contact to Cu2O for Photoelectrochemical Water Splitting

Journal

SMALL
Volume 13, Issue 39, Pages -

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/smll.201702007

Keywords

cuprous oxide (Cu2O); hole transfer layer; nickel oxide (NiO); water splitting

Funding

  1. National Key R&D Program of China [2016YFB0600901]
  2. National Natural Science Foundation of China [21525626, U1463205, U1662111]
  3. Program of Introducing Talents of Discipline to Universities [B06006]

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Cuprous oxide (Cu2O) photocathode is reported as a promising candidate for photoelectrochemical water splitting. The p-type Cu2O usually forms a Schottky junction with the conductive substrate due to its large work function, which blocks the collection of photogenerated holes. NiO is considered as one of the most promising hole transfer layers (HTL) for its high hole mobility, good stability, and easy processability to form a film by spin coating. The utilization of NiO HTL to form an Ohmic back contact to Cu2O is described, thus achieving a positive onset potential of 0.61 V versus reversible hydrogen electrode and a twofold increase of solar conversion efficiency.

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