Hexagonal boron nitride/polymethyl-vinyl siloxane rubber dielectric thermally conductive composites with ideal thermal stabilities

Hexagonal boron nitride/polymethyl-vinyl siloxane rubber (hBN/VMQ) dielectric thermally conductive composites were fabricated via kneading followed by hot compression method. The thermally conductive coefficient (A), thermal diffusion coefficient (alpha), dielectric constant (epsilon) and dielectric loss tangent (tan delta) values were all increased with the increasing addition of hBN fillers. When the volume fraction of hBN fillers was 40 vol%, the corresponding lambda and alpha was 1.110 W/m K and 1.174 mm(2)/s, 6 and 9 times than that of pure VMQ matrix, respectively. The corresponding epsilon and tan delta was 3.51 and 0.0054, respectively. Furthermore, the tensile strength and THeat-resisrance index (T-HRI) values were both maximum with 20 vol% hBN fillers, tensile strength of 3.31 MPa, 12 times than that of pure VMQ matrix (0.28 MPa), and T-HRI of 253.8 degrees C. The obtained hBN/VMQ composites present great potential for packaging in continuous integration and miniaturization of microelectronic devices. (C) 2016 Elsevier Ltd. All rights reserved.