Journal
SEMICONDUCTOR SCIENCE AND TECHNOLOGY
Volume 32, Issue 3, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/1361-6641/aa59a7
Keywords
SiC; integrated circuit; high temperature; radiation hardness; bipolar technology
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Funding
- Swedish Foundation for Strategic Research
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Silicon carbide (SiC) integrated circuits have been suggested for extreme environment operation. The challenge of a new technology is to develop process flow, circuit models and circuit designs for a wide temperature range. A bipolar technology was chosen to avoid the gate dielectric weakness and low mobility drawback of SiC MOSFETs. Higher operation temperatures and better radiation hardness have been demonstrated for bipolar integrated circuits. Both digital and analog circuits have been demonstrated in the range from room temperature to 500 degrees C. Future steps are to demonstrate some mixed signal circuits of greater complexity. There are remaining challenges in contacting, metallization, packaging and reliability.
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