Journal
SCRIPTA MATERIALIA
Volume 128, Issue -, Pages 6-9Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2016.09.028
Keywords
Grain orientation; Anisotropic diffusion; Intermetallic compounds; Electromigration
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Funding
- Ministry of Science and Technology, Taiwan [MOST 102-2221-E-009-040-MY3]
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The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. In addition, grain boundaries did not play an important role in Cu diffusion because they are mostly cyclic twins. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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