Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon

Single-crystal silicon was sliced using a newly developed high-speed fixed-abrasive dicing wire saw. The effects of diamond grit size, wire speed, and number of slicing cycle on the surface roughness and subsurface damage of the workpiece were investigated by surface profiling, Raman spectroscopy and cross-sectional transmission electron microscopy. It was found that by using finer diamond grits and increasing the sawing cycles, the depth of micro dents and saw marks was reduced significantly, and in turn, the surface roughness was improved. A transition from brittle mode to ductile mode machining was confirmed from chip morphology observation when reducing the grit size. The subsurface damaged layers were composed of amorphous layers, dislocated layers with grain boundaries, as well as micro cracks. The smooth surface regions were dominated by amorphous silicon; while within the saw marks, a mixture of amorphous and metastable silicon phases was detected. Inside the micro dents, however, single-crystal silicon was predominant. Furthermore, the significance of silicon amorphization and poly-crystallization was strongly dependent on the wire speed. The higher the wire speed, the less the amorphous and polycrystalline layer. The present study provides comprehensive insights into the surface formation mechanism which is important for process optimization of high-speed and low-damage slicing of single-crystal silicon. (C) 2017 Elsevier Inc. All rights reserved.