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Rigid polyurethane foams incorporated with phase change materials: A state-of-the-art review and future research pathways

Journal

ENERGY AND BUILDINGS
Volume 87, Issue -, Pages 25-36

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.enbuild.2014.10.075

Keywords

Phase change materials; Polyurethane foam; Energy storage; Thermal insulation; Building envelope; Little effort has been spent on the question of the effect of the PCM on the thermal conductivity of the PU foam

Funding

  1. National Nature Science Foundation of China [51106016]
  2. Liao Ning Provincial Nature Science Foundation [2013020130]
  3. Lucerne University of Applied Sciences and Arts
  4. Program for Liaoning Excellent Talents in University
  5. China Scholarship Foundation

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Taking the joint advantages of the thermal energy storage capacity of phase change materials (PCM) and the excellent thermal insulation performance of rigid polyurethane (PU) foams, much attention has been paid to an idea that incorporates PCM into PU foam to promote energy efficiency in buildings. In this paper, a comprehensive review of PU-PCM foams was conducted from the perspectives of synthesis methods, phase change characterization, mechanical strength, cell morphology, thermal performance et al. It is shown that thermal energy storage capacity in PU-PCM foam is enhanced significantly while mechanical strength is decreased with respect to pure PU foam. Thermal conductivity was only investigated by one group with a conclusion that it maintains nearly constant when having PCM content increased. The authors strongly suggest more research work on this topic. In order to modify this new thermal insulating material, some other future research opportunities, such as formulation recipe improvement, thermal insulation performance, thermal aging and general energy saving evaluations, are explored to improve this.composite. A challenge is also raised related to the low active thermal capacity of the PCM with fixed phase change temperature within.a temperature gradient in the PU layer with low thermal conductivity. (C) 2014 Elsevier B.V. All rights reserved.

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