Influence of Acid on the Curing Process of Tannin-sucrose Adhesives

Tannin and sucrose (TS) can be used in a biomaterial-based wood adhesive that requires a higher hot pressing temperature and longer time than traditional resins. To solve these problems, hydrochloric acid and citric acid were utilized as a catalyst during the curing process to decrease energy costs (forming TSH and TSC adhesives, respectively). Thermal analysis revealed that the addition of hydrochloric acid and citric acid resulted in decreases to the thermal thresholds associated with degradation and curing. The resultant insoluble matter ratio verified that the polymerization reaction happened at a lower temperature than the adhesive without acidic conditions. The FT-IR and solid state C-13 NMR spectra showed that the addition of acid compounds acted catalytically and increased the generation of 5-HMF in uncured adhesives. The dimethylene-ether bridges and methylene bridge were formed during the heat treatment. The water resistance of the particleboards manufactured by TSC and TSH adhesives were notably enhanced when the hot-pressing temperature was 180 degrees C. However, an increased hot pressing temperature did not improve the mechanical properties of the particleboard bonded by TSH, which was due to cellulose and hemicellulose decomposition under strong acidity conditions.