Journal
NATURE PHOTONICS
Volume 11, Issue 8, Pages 486-+Publisher
NATURE PUBLISHING GROUP
DOI: 10.1038/NPHOTON.2017.122
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Funding
- New Energy and Industrial Technology Development Organization (NEDO)
- Japan Society for the Promotion of Science (JSPS) [JP26709022]
- JSPS
- Grants-in-Aid for Scientific Research [26709022] Funding Source: KAKEN
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An optical modulator integrated on silicon is a key enabler for high-performance optical interconnects(1-6). However, Si-based optical modulators suffer from low phase-modulation efficiency owing to the weak plasma dispersion effect in Si, which also results in large optical loss. Therefore, it is essential to find a novel modulation scheme for Si photonics. Here, we demonstrate an InGaAsP/Si hybrid metal-oxide-semiconductor (MOS) optical modulator formed by direct wafer bonding(7,8). Electron accumulation at the InGaAsP MOS interface enables the utilization of the electron-induced refractive index change in InGaAsP, which is significantly greater than that in Si (refs 9,10). The presented modulator exhibits a phase-modulation efficiency of 0.047 Vcm and low optical attenuation of 0.23 dB at pi phase shift at 1.55 mu m wavelength, which are approximately 5 times higher and 10 times lower than Si MOS optical modulators(11-17), respectively. This approach provides a new, high-performance phase-modulation scheme for Si photonics.
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