4.7 Article

In-Place Printing of Carbon Nanotube Transistors at Low Temperature

Journal

ACS APPLIED NANO MATERIALS
Volume 1, Issue 4, Pages 1863-1869

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsanm.8b00269

Keywords

carbon nanotubes (CNT); thin-film transistors (TFT); low temperature printing silver nanowires; additive printing

Funding

  1. Department of Defense Congressionally Directed Medical Research Program (CDMRP) [W81XWH-17-2-0045]
  2. National Science Foundation (NSF) through the NSF graduate research fellowship [DGE 11010101-0417-7172-7172/4103]
  3. National Science Foundation as part of the National Nanotechnology Coordinated Infrastructure (NNCI) [ECCS-1542015]

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Interest in flexible, stretchable, and wearable electronics has motivated the development of additive printing to fabricate customizable devices and systems directly onto virtually any surface. However, progress has been limited by the relatively high temperatures (>200 degrees C) required to sinter metallic inks and time-consuming process steps, many of which require removal of the substrate from the printer for coating, washing, or sintering. In this work, we addressed these challenges and demonstrate carbon nanotube thin-film transistors (CNT-TFTs) that are fabricated by aerosol jet printing with the substrate never leaving the printer. The full in-place printing approach, from first step to last, used a maximum process temperature of only 80 degrees C on the printer platen. Silver nanowire (Ag NW) ink was found to be most viable for low-temperature, in-place sintering while still yielding good electrical interfaces to the CNT thin-film channels. These aerosol-jet printed Ag NW films were conductive immediately after fabrication, which is the key component enabling rapid and sequential in-place printing. The devices exhibit on-currents as high as 80 A/mm, effective mobilities of 12 cm(2)/(17-s), and on/off current ratios exceeding 10(5). These findings provide a promising path forward toward the additive manufacture of flexible and stretchable electronics in a low-cost, highly customizable, and agile manner.

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