Journal
PRODCEEDINGS OF THE 2018 IEEE 30TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD)
Volume -, Issue -, Pages 200-203Publisher
IEEE
Keywords
III-V semiconductor materials; Aluminum gallium nitride; Schottky diodes; HEMTs; Heterostructures
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Funding
- French Programme de Peconomie numerique des Investissements d'Avenir
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We present significant performance enhancements of AlGaN/GaN power Schottky diodes on 200 mm silicon substrates achieved by optimizing the anode fabrication and the epitaxial layers. 600V rated AlGaN/GaN power diodes using a MIS (Metal Insulator Semiconductor)-gated Schottky anode were processed using a CMOS compatible process flow transferable to mass production environments. Turn-on voltages V-T around 0.6 V at 25 degrees C, forward voltages V-F lower than 1.6 V at 100 mA/mm and 25 degrees C, reverse leakage currents I-REV ower than 1 mu A/mm at 600 V and 150 degrees C and excellent dynamic performances were achieved and outperform state of the art 600V rated AlGaN/GaN Schottky diodes.
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