Journal
NANOTECHNOLOGY
Volume 28, Issue 30, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/1361-6528/aa7624
Keywords
hafnium zirconium oxide; ferroelectric thin film; reactive sputtering; oxygen partial pressure; surface energy effect
Funding
- Global Research Laboratory Program of the Ministry of Science, ICT and Future Planning of the Republic of Korea [2012K1A1A2040157]
- National Research Foundation of Korea (NRF) grant - South Korean government (MSIP) [2014R1A2A1A10052979]
- National Research Foundation of Korea [2014R1A2A1A10052979, 2012K1A1A2040157] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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HfO2-ZrO2 solid-solution films were prepared by radio frequency sputtering, and the subsequent annealing process was optimized to render enhanced ferroelectric behavior. The target power, working pressure and O-2 partial pressure ratios were varied, along with the annealing gas, time and temperature. Then, the film's structural and electrical properties were carefully scrutinized. Oxygen-deficient conditions were necessary during the sputter deposition to suppress grain growth, while annealing by O-2 gas was critical to avoid defects and leakage problems. It is expected that the grain size difference under various deposition conditions combined with the degree of TiN top and bottom electrode oxidation by O-2 gas will result in different ferroelectric behaviors. As a result, Hf0.5Zr0.5O2 prepared by radio frequency sputtering showed optimized ferroelectricity at 0% of O-2 reactive gas, with a doubled remnant polarization value of similar to 20 mu C cm(-2) at a thickness of 11 nm. Film growth conditions with a high growth rate (4-5 nm min(-1)) were favorable for achieving the ferroelectric phase film, which feasibly suppressed both the grain growth and accompanying monoclinic phase formation.
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