Journal
MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING
Volume 26, Issue 1, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/1361-651X/aa9a5b
Keywords
rapid solidification; dynamic TEM; phase-field; CALPHAD; Cu-Ni alloys
Funding
- US Department of Energy by Lawrence Livermore National Laboratory [DE-AC52-07NA27344]
- Laboratory Directed Research and Development Program [15-ERD-006]
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A combination of dynamic transmission electron microscopy (DTEM) experiments and CALPHAD-informed phase-field simulations was used to study rapid solidification in Cu-Ni thin-film alloys. Experiments-conducted in the DTEM-consisted of in situ laser melting and determination of the solidification kinetics by monitoring the solid-liquid interface and the overall microstructure evolution (time-resolved measurements) during the solidification process. Modelling of the Cu-Ni alloy microstructure evolution was based on a phase-field model that included realistic Gibbs energies and diffusion coefficients from the CALPHAD framework (thermodynamic and mobility databases). DTEM and post mortem experiments highlighted the formation of microsegregation-free columnar grains with interface velocities varying from similar to 0.1 to similar to 0.6 m s(-1). After an 'incubation' time, the velocity of the planar solid-liquid interface accelerated until solidification was complete. In addition, a decrease of the temperature gradient induced a decrease in the interface velocity. The modelling strategy permitted the simulation (in 1D and 2D) of the solidification process from the initially diffusion-controlled to the nearly partitionless regimes. Finally, results of DTEM experiments and phase-field simulations (grain morphology, solute distribution, and solid-liquid interface velocity) were consistent at similar time (mu s) and spatial scales (mu m).
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