Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications

This paper concerns the study of a temporary bonding process: 3M (TM) Wafer Support System. This process is dedicated to the handling of thin silicon wafers with a glass carrier bonded with a UV curable polymer. The dismounting process is achieved after a laser treatment Firstly, the 300 mm bonding process leads to a very homogeneous bonded structure without any bonding defects. The morphology of the bonded structure is mainly dependent of the morphology of the glass. Secondly this process is also compatible with a back - grinding process and the thinned silicon structure can be processed up to 250 degrees C. When using a blank silicon wafer, the 3M (TM) dismounting process (laser and peeling) leads to a silicon thin wafer without any cracks, chippings or adhesive traces. Finally the laser process can be removed from the debonding steps and a single mechanical dismounting process can be used. (C) 2017 Elsevier B.V. All rights reserved.