Journal
MATERIALS LETTERS
Volume 189, Issue -, Pages 1-4Publisher
ELSEVIER SCIENCE BV
DOI: 10.1016/j.matlet.2016.11.041
Keywords
Semiconductor; Cell adhesion; PC 12 cells; Topography; Surface functionalization; Peptides; Aluminum nitride
Ask authors/readers for more resources
High-quality, electronic-grade, aluminum nitride thin films grown by reactive sputtering were studied in vitro. The semiconductor material showed high degree of stability in cell culture with very little Al leaching over time. Unlike other III-nitride materials, clean AIN does not promote the adhesion of cells to its surface. The work demonstrates that functionalization with peptides can be used to reverse this behavior. The presence of AIN in cell culture does not have any adverse effects on neurotypic cell behavior as confirmed by cell viability and reactive oxygen species assays.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available