☆ 3.8 Proceedings Paper

A 2.1TFLOPS/W Mobile Deep RL Accelerator with Transposable PE Array and Experience Compression

2019 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC) (2019)

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Journal

2019 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC)
Volume 62, Issue -, Pages 136-+

Publisher

IEEE
DOI: 10.1109/isscc.2019.8662447

Keywords

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Categories

Engineering, Electrical & Electronic

Funding

  1. Samsung Research Funding & Incubation Center for Future Technology [SRFC-TB1703-09]

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Reagent

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