Journal
LASER & PHOTONICS REVIEWS
Volume 11, Issue 4, Pages -Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/lpor.201700063
Keywords
on-chip light sources; optical interconnections; silicon photonics; heterogeneous integration; transfer printing; III-V semiconductors; quantum dots
Categories
Funding
- European Research Council [693447, 645314, 688519, 267853, 259076]
- European Space Agency (ESA Artes 5.1 EPFC)
- IMEC's industry-affiliation program on optical I/O
- [IAP P7/35]
- European Research Council (ERC) [267853, 259076, 693447] Funding Source: European Research Council (ERC)
Ask authors/readers for more resources
Silicon does not emit light efficiently, therefore the integration of other light-emitting materials is highly demanded for silicon photonic integrated circuits. A number of integration approaches have been extensively explored in the past decade. Here, the most recent progress in this field is reviewed, covering the integration approaches of III-V-to-silicon bonding, transfer printing, epitaxial growth and the use of colloidal quantum dots. The basic approaches to create waveguide-coupled on-chip light sources for different application scenarios are discussed, both for silicon and silicon nitride based waveguides. A selection of recent representative device demonstrations is presented, including high speed DFB lasers, ultra-dense comb lasers, short (850nm) and long (2.3 mu m) wavelength lasers, wide-band LEDs, monolithic O-band lasers and micro-disk lasers operating in the visible. The challenges and opportunities of these approaches are discussed.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available