Journal
JOURNAL OF SUPERHARD MATERIALS
Volume 41, Issue 1, Pages 32-37Publisher
ALLERTON PRESS INC
DOI: 10.3103/S1063457619010040
Keywords
thin solid films; nanocomposite and nanolayered films; PECVD equipment; VUP-5(M); PECVD; ALD; deposition process variables
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The paper describes the main design principles of plasma-enhanced chemical vapor deposition (PECVD) equipment based on a Mod. VUP-5(M) universal vacuum pumping station, and the application of such equipment for deposition of thin films, including nanolayered ones, from vapors of usually liquid precursors. The method can be classified as PECVD in a gas atmosphere activated by E-type radio-frequency (RF) plasma in continuous flow systems (the open-tube method). The equipment is universal in terms of the types of precursors to be used and has a sufficient set of process variable in order to provide deposition of a wide range of coatings with a controlled thickness from 1 to 2000 nm. The PECVD equipment favorably supplements the VUP-5(M) functionalities and extends performance without any significant alteration of its design.
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