Journal
NANOSCALE
Volume 11, Issue 23, Pages 11360-11368Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c9nr02491c
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Funding
- National Natural Science Foundation of China [51373070]
- Joint Pre-research Foundation of Ministry of Education of China [6141A02022228]
- MOE SAFEA
- 111 Project [B13025]
- National First-class Discipline Program of Light Industry Technology and Engineering [LITE2018-19]
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Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices. However, the conventional polymer-based thermally conductive composites with randomly distributed filler particles usually yield an undesired value because of the lack of efficient heat transfer pathways. Therefore, constructing a three-dimensional interconnected filler structure is greatly desirable for realizing high thermal conductivity enhancement in composites. Herein, graphene oxide (GO) was used as a thermally conductive filler due to its excellent thermal conductivity and coated with polydopamine (PDA) to enhance its electric insulation performance. A unique particle-constructing method was adopted for fabricating highly ordered three-dimensional GO-based polymer composites, throughout which the GO-PDA formed an intact, uniform and well-defined network structure. The composite, even with a very low GO-PDA loading of 0.96 vol%, exhibited both high in-plane (4.13 W m(-1) K-1) and through-plane (4.56 W m(-1) K-1) thermal conductivities and also presented excellent electrically insulating properties (>10(14) omega cm). These composites have promising applications in heat dissipation of next-generation portable and collapsible electronic devices.
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