Journal
JOURNAL OF THERMOPLASTIC COMPOSITE MATERIALS
Volume 31, Issue 5, Pages 657-667Publisher
SAGE PUBLICATIONS LTD
DOI: 10.1177/0892705717718238
Keywords
Expanded polystyrene; plasma activation; magnetron sputtering; SiO2 thin films; thermal stability
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Currently, polymeric insulation materials are widely used for energy saving in buildings. Despite of all benefits, these materials are generally sensitive to heat and highly flammable. This work discusses possibility to improve heat resistance of expanded polystyrene (EPS) foam using thin silicon dioxide (SiO2) films deposited by magnetron sputtering technique. In order to increase surface energy and adherence of SiO2 thin films to substrate EPS was plasma pretreated before films' depositions using pulsed DC plasma generator for 40 s in argon gas. SiO2 formation was done in reactive argon and oxygen gas atmosphere. Laboratory made equipment was used for flame torch-induced heat resistance experiments. Results showed that silicon oxide films remains stable during heat resistance experiments up to 5 s and fully protects polystyrene (PS) substrate. Films are relatively stable for 30 s and 60 s and partially protect PS from melting and ignition. Scanning electron microscopy, energy-dispersive X-ray spectroscopy, and X-ray photoelectron spectroscopy analysis confirmed that SiO2 layer, which is distributed uniformly on the EPS surface, could work as a good heat resistant material.
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