Size dependent thermal buckling and postbuckling of functionally graded circular microplates based on modified couple stress theory

In this article, size-dependent thermal buckling and postbuckling behavior of a functionally graded circular microplate under uniform temperature rise field and clamped boundary conditions is investigated. Material properties are assumed to gradually vary through the thickness according to a simple power law. Equilibrium equations and associated boundary conditions are derived using variational method and based on modified couple stress theory, classical plate theory and von Karman geometric nonlinearity. The differential quadrature method is used to discretize the governing equations. This technique is accompanied by an iterative method to determine the thermal postbuckling behavior of microplate. Finally, effects of length scale parameter, power law index and ratio of thickness to radius on the thermal buckling and postbuckling behavior of FG circular microplate are investigated.