4.6 Article

Effect of energy per atom (E/n) on the Ar gas cluster ion beam (Ar-GCIB) and O2+ cosputter process

Journal

ANALYST
Volume 144, Issue 10, Pages 3323-3333

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/c8an02452a

Keywords

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Funding

  1. Academia Sinica
  2. Thematic Program [AS-107-TP-A09]
  3. Sustainability Science Program [AS-SS-108-03]
  4. Taiwan Ministry of Science and Technology [103-2628-M-001-003-MY3, 103-2113-M-001-030-MY3, 106-2113-M-001-021, 107-2113-M-001-005]

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Gas cluster ion beam (GCIB) is a promising technique for preserving molecular structures during ion sputtering and successfully profiling biological and soft materials. However, although GCIB yields lower damage accumulation compared with C-60(+) and monoatomic ion beams, the inevitable alteration of the chemical structure can introduce artifacts into the resulting depth profile. To enhance the ionization yield and further mask damage, a low-energy O-2(+) (200-500 V) cosputter can be applied. While the energy per atom (E/n) of GCIB is known to be an important factor influencing the sputter process, the manner through which E/n affects the GCIB-O-2(+) cosputter process remains unclear. In this study, poly(ethylene terephthalate) (PET) was used as a model material to investigate the sputter process of 10-20 kV Ar1000-4000 + (E/n = 2.5-20 eV per atom) with and without O-2(+) cosputter at different energies and currents. Time-of-flight secondary ion mass spectrometry (ToF-SIMS) with Bi-3(2+) as the primary ion was used to examine surfaces sputtered at different fluences. The sputter craters were also measured by alpha-step and atomic force microscopy in quantitative imaging mode. The SIMS results showed that the steady-state cannot be obtained with E/n values of less than 5 eV per atom due to damage accumulation using single GCIB sputtering. With a moderate E/n value of 5-15 eV per atom, the steady-state can be obtained, but the similar to 50% decay in intensity indicated that damage cannot be masked completely despite the higher sputter yield. Furthermore, the surface Young's modulus decreased with increasing E/n, suggesting that depolymerization occurred. At an E/n value of 20 eV per atom, a failed profile was obtained with rapidly decreased sputter rate and secondary ion intensity due to the ion-induced crosslink. With O-2(+) cosputtering and a moderate E/n value, the oxidized species generated by O-2(+) enhanced the ionization yield, which led to a higher ion intensity at steady-state in general. Because higher kinetic energy or current density of O-2(+) led to a larger interaction volume and more structural damage that suppressed molecular ion intensity, the enhancement from O-2(+) was most apparent with low-energy-high-current (200 V, 80 mu A cm(-2)) or high-energy-low-current (500 V, 5 mu A cm(-2)) O-2(+) cosputtering with 0.5 mu A cm(-2) GCIBs. In these cases, little or no intensity drop was observed at the steady-state.

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