4.7 Article

High rate laser deposition of conductive copper microstructures from deep eutectic solvents

Journal

CHEMICAL COMMUNICATIONS
Volume 55, Issue 65, Pages 9626-9628

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/c9cc05184h

Keywords

-

Funding

  1. Russian Scientific Foundation [18-79-00144]
  2. Russian Science Foundation [18-79-00144] Funding Source: Russian Science Foundation

Ask authors/readers for more resources

In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.7
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available