Journal
2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)
Volume -, Issue -, Pages 56-60Publisher
IEEE
DOI: 10.23919/icep.2019.8733527
Keywords
Cu wire bonding; Pd effect; Corrosion resistance; Grain boundary cross-effect
Funding
- Nanotechnology Platform Program of the Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan
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Palladium (Pd) has played a big role to improve the corrosion resistance of copper (Cu) wire. To examine the corrosion resistance of Cu wire, the Cu/Al interface obtained by sputtering [1] was evaluated. In particular, the effect of Pd on Cu wire joints was investigated by preparing pseudo Palladium Coated Copper (PCC) samples and varying the Pd concentration. In this paper, pseudo PCC wire joint samples were evaluated for corrosion resistance and the results compared with those from actual Cu and PCC wire joint samples.
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