Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 26, Issue 5, Pages 1030-1039Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2017.2703594
Keywords
3-D microelectromechanical systems (MEMS); inertial measurement unit; inertial sensors; micro-assembly
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Funding
- Defense Advanced Research Projects Agency
- U.S. Navy [N66001-13-1-4021]
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This paper presents a miniature 50 mm(3) inertial measurement unit (IMU) implemented using a folded micro-electromechanical systems (MEMS) process. The approach is based on wafer-level fabrication of high aspect-ratio single-axis sensors interconnected by flexible hinges and folded into a 3-D configuration, like a silicon Origami [1]. Two different materials for flexible hinges have been explored, including photo-definable polyimide and parylene-C. We report, for the first time, an IMU prototype with seven operational sensors: three accelerometers, three gyroscopes, and a prototype of a reference clock. This paper concludes with the results of experimental characterization of inertial sensors demonstrating the feasibility of the proposed approach for a compact IMU. [2016-0267]
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